Key Terms & Concepts — UPSC Mains
EUV Lithography
"An advanced semiconductor manufacturing technique using 13.5 nm wavelength light to print nanometre-scale circuit patterns on silicon wafers"
Extreme Ultraviolet (EUV) Lithography is a next-generation photolithography technology used in semiconductor fabrication to print circuit patterns at the most advanced nodes (7 nm, 5 nm, 3 nm, and below). It uses light with a wavelength of 13.5 nanometres — much shorter than the 193 nm wavelength used in older deep ultraviolet (DUV) systems — enabling finer pattern resolution. Only ASML (Netherlands) manufactures EUV lithography machines, which cost approximately USD 200-400 million each and weigh over 180 tonnes. Helium is used in EUV lithography environments to prevent contamination of the optical system. The 2026 helium supply crisis caused by Iran's attack on Qatar's Ras Laffan hub threatens semiconductor fabrication processes globally, including India's Tata Electronics fab at Dholera, Gujarat.
EUV lithography is relevant for UPSC GS-3 (Science and Technology, semiconductor policy) as it underpins the India Semiconductor Mission. Understanding the technology, ASML's monopoly, and supply chain vulnerabilities (helium, critical minerals) is important for questions on strategic autonomy and technology dependence.
- 1 Uses 13.5 nm wavelength light (vs 193 nm in DUV lithography)
- 2 Only ASML (Netherlands) manufactures EUV machines globally
- 3 Each machine costs USD 200-400 million; weighs over 180 tonnes
- 4 Enables sub-7 nm chip fabrication (used by TSMC, Samsung, Intel)
- 5 Helium is essential for EUV environments to prevent contamination
- 6 India's semiconductor fabs will need access to EUV technology for advanced nodes
- 7 ASML subject to US and Dutch export controls restricting sales to China
Iran's attack on Qatar's Ras Laffan hub disrupted 33% of global helium supply, threatening EUV lithography operations and semiconductor fabrication at India's planned Dholera fab.